微熔覆技术的发展及应用 -

姓名
邮箱
手机号码
标题
留言内容
验证码

微熔覆技术的发展及应用

华中科技大学光电子科学与工程学院武汉光电国家实验室(筹) 部,湖北武汉 430074

基金项目:

国家863高技术研究发展计划资助项目(No.2007AA030114)

详细信息

作者简介:
蔡志祥(1980—),男,江苏盐城人,讲师,主要从事微纳制造技术方面的研究。E-mail: caizhix@gmail.com

中图分类号:TG156.99
计量
- 文章访问数:4287
- HTML全文浏览量:417
- PDF下载量:2546
- 被引次数:0
出版历程
- 收稿日期:2010-03-11
- 修回日期:2010-05-13
- 刊出日期:2010-10-25

Development and applications of laser micro cladding

Laser Division,Wuhan National Laboratory of Optoelectronics,School of Optoelectronics Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China

摘要

摘要:基于的直写技术具有加工周期短、使用灵活、无需掩模、环境要求低等诸多优点,其在微电子等领域应用广泛。本文引入了一种新的直写技术微熔覆技术,介绍了该技术的工艺过程及特点,并在此基础上集成制造了微熔覆设备。通过与物质的相互作用原理,理论分析了微熔覆电子浆料的成型机理。最后,举例说明该技术在微电子、光电子以及传感器领域的应用,并对该技术的发展趋势进行了初步预测,认为该技术在混合集成电路基板的加工、微型传感器和加热器的制造、平面无源电子器件和分立无源电子器件的研制以及生物芯片、电子封装等领域有好的发展前景。
- 微熔覆/
- 直写技术/
- 电子浆料
Abstract:Laser-based direct-writing techniques have gained increased interests in the microelectronic industry, which have some outstanding advantages such as short processing cycles, strong flexibility, no mask, and low environmental requirements. A new technology called laser micro-cladding technology was presented in this paper and the principles and characteristics of the technology were described in detail. On the basis of above researches, the equipment for laser micro cladding was assembled, then by studying the principle of interaction between laser and matter, the formation mechanism of laser micro cladding electronic pastes was analyzed. Finally, the applications of the technology to micro-electronic, optoelectronic and sensor areas were illustrated. Moreover, the development of this technology was predicted, and it was pointed out that the technology will show good prospects in fields of hybrid integrated circuit substrates, micro-sensors, micro-heaters, plane passive electronic devices, discrete devices, biochip and electronic packages.
- laser micro-cladding/
- direct-writing technology/
- electronic paste

HTML全文

参考文献 (1)

[1] 张立鼎.先进电子制造技术[M] .北京:国防工业出版社,2000. ZHANG D. Advanced Electron Technique of Manufacture[M]. Beijing:Defence Inductry Press,2000.(in Chinese) [2] 刘敬伟,曾晓雁 . 直写技术的现状和展望[J]. 杂志 ,2001,22(6):15-18. LIU J W,ZENG X Y. Status and prospect of laser direct writing[J].Laser J.,2001,22(6):15-18.(in Chinese) [3] HON K K B,LI L,HUTCHINGS I M. Direct writing technology-advances and developments [J].CIRP Annals-Manufacturing Technol.,2008,57(2):601-620. [4] VENUVINOD P K,MA W Y.Rapid Prototyping:Laser-Based and Other Technologies[M]. Dordrecht:Kluwer Academic Publishers,2004. [5] DANFORTH S C,DIMOS D,PRINZ F. Materials development for direct-write technologies . In Materials Research Society Spring 2000 Meeting,Proceedings of Symposium V,San Francisco,23-27,April,2000. [6] ROHMUND F,MORJAN R E,LEDOUX G,et al.. Carbon nanotube films grown by laser-assisted chemical vapor deposition[J].J. Vac. Sci. Technol. B,2002,20:802-804. [7] KWOK K,CHIU W K S. Growth of carbon nanotubes by open-air laser-induced chemical vapor deposition[J].Carbon,2005,43:437-439. [8] WEE L M,LI L. Multiple-layer laser direct writing metal deposition in electrolyte solution[J].App. Surf. Sci.,2005,247:285-293. [9] SHACHAM Y,DUBIN V,ANGYAL M. Electroless copper deposition for ULSI[J].Thin Solid Films,1995,262:93-103. [10] CHRISEY D B,PIQUE A,GERALD J F. New approach to laser direct writing active and passive mesoscopic circuit elements[J].Appl. Surf. Sci.,2000,154-155:593-600. [11] ZENG X Y,LI X Y,LIU J W,et al.. Direct fabrication of electric components on insulated boards by laser micro cladding electronic pastes[J]. IEEE Transactions on advanced packaging,2006,29(2):291-293. [12] LI X Y,LI H L,CHEN Y Q,et al.. Silver conductor fabrication by laser direct writing on Al₂O₃substrate[J].Appl. Phys. A,2004,79(8):1861-1863. [13] CAI Z X,LI X Y,HU Q W,et al.. Fabrication of microheater by laser micro cladding electronic paste[J].Mater. Sci. Eng. B,2009,157(1):15-19. [14] CAI Z X,LI X Y,HU Q W,et al.. Laser sintering of thick-film PTC thermistor paste deposited by micro-pen direct writing[J].Microelectronics Eng.,2009,86(1):10-15. [15] CAI Z X,LI X Y,ZENG X Y. Direct fabrication of SnO₂-based thick film gas sensor using micropen direct writing and laser micro cladding[J].Sensor Actuator B Chem.,2009,137(1):340-344. [16] LI X Y,LI H L,LIU J W,et al.. Conductive line preparation on resin surfaces by laser micro-cladding conductive pastes[J].Appl. Surface Sci.,2004,233(1-4):51-57. [17] LI X Y,ZENG X Y. Parameters and quality control by pulsed Nd:YAG laser cutting . ICALEO 2003,the 22nd International Congress on Applications of Lasers & Electro-optics,Jacksonville,Florida,13-16 Oct,2003. [18] LI H L,ZENG X Y,LI H F,et al.. Research on film thickness of micro-fine conductive line from the laser cladding and flexibly direct writing technique[J].Chinese Opt. Lett.,2004,2(11):654-657. [19] 李慧玲,曾晓雁,李祥友. 玻璃基板上微细熔覆直写电阻技术的研究[J]. 中国 ,2005,32(2):281-286. LI H L,ZENG X Y,LI X Y. Direct fabrication of resistor on glass board by laser micro-fine cladding[J].Chinese J. Lasers,2005,32(2):281-286.(in Chinese) [20] 李慧玲,曾晓雁,李祥友,等. 微细熔覆柔性直写厚膜导带组织性能的研究[J]. 中国 ,2005,32(7):1001-1005. LI H L,ZENG X Y,LI X Y,et al.. Research on structure property of thick-film conductive lines fabricated by laser micro-fine cladding and flexibly direct writing[J].Chinese J. Lasers,2005,32(7):1001-1005.(in Chinese) [21] 李慧玲,曾晓雁. 搭接量对微细熔覆柔性直写厚膜电阻组织性能的影响[J]. 中国 ,2005,32(11):1554-1560. LI H L,ZENG X Y. Effect of overlapped spaces on structure property of thick-film resistors flexibly and directly fabricated by laser micro-cladding[J].Chinese J. Lasers,2005,32(11):1554-1560.(in Chinese) [22] CAO Y,LI X Y,ZENG X Y. Frequency characteristics of the MIM thick film capacitors fabricated by laser micro-cladding electronic pastes[J].Mat. Sci. Eng. B-SOLID,2008,150(3):157-162. [23] 王少飞,曹宇,王小宝,等. 微细熔覆快速制造微加热器阵列[J]. 中国 ,2007,34(11):1567-1570. WANG SH F,CAO Y,WANG X B,et al.. Microheater array fabrication by laser micro-cladding method[J].Chinese J. Lasers,2007,34(11):1567-1570.(in Chinese) [24] 李祥友,蔡志祥,曹宇,等. 基于微细笔和微熔覆的设备研制[J]. 应用 ,2007,27(2):81-84. LI X Y,CAI ZH X,CAI Y,et al.. Equipment manufacture based on laser micro-cladding & micropen[J].Appl. Laser,2007,27(2):81-84.(in Chinese) [25] MEUNIER M,IZQUIERDO R,DESJARDINS P,et al.. Laser direct writing of tungsten from WF6[J].Thin Solid Films,1992,218(1-2):137-143. [26] MOILANEN H,REMES J,LEPPAVUORI S,et al.. Low resistivity LCVD direct write Cu conductor lines for IC customization[J].Phys. Scipta T,1997,T69:237-241. [27] TERRILL R E,CHURCH K H,MOON M. Laser chemical vapor deposition for microelectronics production . IEEE Aerospace Applications Conference Proceedings,1998,1:377-382. [28] POPOV C,IVANOV B,SHANOV V. Laser-induced chemical vapor deposition of aluminum from trimethylamine alane[J].J. Appl. Phys.,1994,75(7):3687-3689. [29] LEHMANN O,STUKE M. Laser-driven movement of three-dimensional microstructures generated by laser rapid prototyping[J].Science,1995,270(5242):1644-1646. [30] LEHMANN O,STUKE M. Three-dimensional laser direct writing of electrically conducting and isolating microstructures[J].Mater. Lett.,1994,21(2):131-136. [31] Von GUTFELD R J,TYNAN E E,MELCHER R L,et al.. Laser enhanced electroplating and maskless pattern generation[J].Appl. Phys. Lett.,1979,35(9):651-653. [32] KRIPESH V,GUST W,BHATNAGAR S K,et al.Effect of Nd:YAG laser micromachining on gold conductor printed over ceramic substrates[J].Mater. Lett.,2000,44(6):347-351. [33] CHEN Q J,IMEN K,ALLEN S D. Laser enhanced electroless plating of micron-scale copper wires[J].J. Electrochem. Society,2000,147(4):1418-1422. [34] KORDS K,NNAI L,GALBC S G,et al.. Reaction dynamics of CW Ar⁺laser induced copper dirct writing from liquid electrolyte on polyimide substrates[J].Appl. Surface Sci.,2000,158(1):127-133. [35] KORD S K,BALI K,LEPP VUORI S,et al.. Laser direct writing of copper on polyimide surfaces from solution[J].Appl. Surface Sci.,2000,154-155:399-404. [36] SZRéNYI T,GERETOVSZKY Z,T TH J,et al.. Laser direct writng of tin oxide patterns[J].Vacuum,1998,50(3-4):327-329. [37] TOFTMANN B,PAPANTONAKIS M R,AUYEUNG R C Y,et al.. UV and RIR matrix assisted pulsed laser deposition of organic MEH-PPV films[J].Thin Solid Films,2004,453-454:177-181. [38] CHRISEY D B,PIQUE A,MODI R,et al.. Direct writing of conformal mesoscopic electronic devices by MAPLE DW[J].Appl. Surface Sci.,2000,168(1-4):345-352. [39] SANO T,YAMADA H,NAKAYAMA T,et al.. Laser induced rear ablation of metal thin films[J].SPIE,2002,4426:70-73.

施引文献

附加信息 (0)

访问统计