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双有源区结构4.7 μm中波红外量子级联 器

王渝沛 章宇航 罗晓玥 钱晨灏 程洋 赵武 魏志祥 韩迪仪 孙方圆 王俊 周大勇

王渝沛, 章宇航, 罗晓玥, 钱晨灏, 程洋, 赵武, 魏志祥, 韩迪仪, 孙方圆, 王俊, 周大勇. 双有源区结构4.7 μm中波红外量子级联 器[J]. , 2024, 17(5): 1042-1049. doi: 10.37188/CO.2023-0239
引用本文: 王渝沛, 章宇航, 罗晓玥, 钱晨灏, 程洋, 赵武, 魏志祥, 韩迪仪, 孙方圆, 王俊, 周大勇. 双有源区结构4.7 μm中波红外量子级联 器[J]. , 2024, 17(5): 1042-1049. doi: 10.37188/CO.2023-0239
WANG Yu-pei, ZHANG Yu-hang, LUO Xiao-yue, QIAN Chen-hao, CHENG Yang, ZHAO Wu, WEI Zhi-xiang, HAN Di-yi, SUN Fang-yuan, WANG Jun, ZHOU Da-yong. 4.7 μm mid-wave infrared quantum cascade laser with double active region structure[J]. Chinese Optics, 2024, 17(5): 1042-1049. doi: 10.37188/CO.2023-0239
Citation: WANG Yu-pei, ZHANG Yu-hang, LUO Xiao-yue, QIAN Chen-hao, CHENG Yang, ZHAO Wu, WEI Zhi-xiang, HAN Di-yi, SUN Fang-yuan, WANG Jun, ZHOU Da-yong. 4.7 μm mid-wave infrared quantum cascade laser with double active region structure[J]. Chinese Optics, 2024, 17(5): 1042-1049. doi: 10.37188/CO.2023-0239

双有源区结构4.7 μm中波红外量子级联 器

基金项目: 国家重点研发计划(No. 2018YFB1107300)
详细信息
    作者简介:

    王 俊(1965—),男,湖北仙桃人,博士,教授,博士生导师,1997 年于加拿大McMaster大学取得博士学位,主要从事半导体 器方面的研究。E-mail:wjdz@scu.edu.cn

  • 中图分类号: TP394.1;TH691.9

4.7 μm mid-wave infrared quantum cascade laser with double active region structure

Funds: Supported by the National Key Research and Development Program of China (No. 2018YFB1107300)
More Information
  • 摘要:

    本文报道了一种基于双有源区的4.7 μm中波红外量子级联 器,脊宽为9.5 μm,可实现室温连续基横模工作。通过在单有源区中心插入0.8 μm InP间隔层,将原有的单有源区转变成双有源区结构,可显著降低器件有源区的峰值温度,同时抑制高阶横模的产生。在288 K温度下,腔长为5 mm的双有源区器件的阈值电流密度为1.14 kA/cm2,连续输出功率为0.71 W,快轴发散角为27.3°,慢轴发散角为18.1°。同采用常规单有源区结构器件相比,采用双有源区结构的器件,其最大光输出功率未出现退化,同时器件慢轴方向由多模变化为基横模,光束质量得到了显著改善。本工作为改善高功率中波量子级联 器的慢轴光束质量提供了一种解决思路。

     

  • 图 1  (a)有限元仿真结构示意图;(b) 在有源区插入不同厚度InP的横向模态的相对品质因子图

    Figure 1.  (a) Schematic diagram of the finite element simulation structure; (b) relative figure of merit for transverse modes when inserting different InP thicknesses in active region

    图 2  (a)单有源区器件及(b)双有源区器件热学仿真结果

    Figure 2.  Thermal simulation results of (a) single active region device and (b) double active region device

    图 3  Sample 1和Sample 2的(a)X射线双晶衍射及其(b)放大图

    Figure 3.  (a) X-ray double diffraction and their (b) enlarged images of Sample 1 and Sample 2

    图 4  (a) Device 1和(c) Device 2的结构示意图;(b) Device 1和(d) Device 2前腔面在电镜下的横截面图

    Figure 4.  Schematic diagram of (a) Device 1 and (c) Device 2; cross-sectional SEM images of the front cavity of (b) Device 1 and (d) Device 2

    图 5  (a) Device 1和Device 2在连续模式下的PIV曲线;(b) Device 1和Device 2在阈值电流下的光谱

    Figure 5.  (a) PIV curves of Device 1 and Device 2 in continuous wave; (b) spectra of Device 1 and Device 2 at threshold current

    图 6  Device 1和Device 2在(a)慢轴方向及(b)快轴方向的远场

    Figure 6.  Far fields of Device 1 and Device 2 in the (a) slow axis direction and (b) fast axis directions

    表  1  不同材料不同掺杂浓度的有效折射率[25]

    Table  1.   Effective refractive indexes of different materials with different doping conditions

    Materials Doping density Refractive index
    InP substrate 2×1017 3.084+2.00000E-4i
    InP 2×1016 3.091+2.00000E-5i
    InGaAs 2×1016 3.393+7.88405E-5i
    Active 2×1017 3.245+4.01336E-5i
    InP 2×1017 3.084+2.00000E-4i
    InP 1×1017 3.088+1.00000E-4i
    InP 5×1018 2.893+5.00000E-3i
    InP 2×1019 2.188+2.70000E-2i
    Au / 3.319+1.84110E+1i
    Si3N4 / 1.358+6.50000E-4i
    Fe:InP / 3.099+6.34895E-8i
    下载: 导出CSV

    表  2  300 K温度下不同材料的热导率[28]

    Table  2.   Thermal conductivities of different materials at 300 K temperature

    Materials Thermal conductivity/W·m−1·K−1
    InP 72.18
    InGaAs 4.64
    Active(longitudinal) 0.76
    Active(lateral) 4.48
    Si3N4 13.9
    AuSn 57
    Cu 398.03
    AlN 257.5
    下载: 导出CSV
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  • 收稿日期:  2024-01-03
  • 修回日期:  2024-01-30
  • 录用日期:  2024-03-13
  • 网络出版日期:  2024-05-10

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