Design of an high-efficiency wheeled polishing tool combined with co-rotation and self-rotation movement
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摘要:为了提高光学加工效率,缩短大口径光学元件制造周期,本文提出了一种具有公自转运动模式的新型高效抛光方式,对其结构、工作原理以及去除特性进行了研究。首先,介绍了公自转抛光装置机械结构及工作原理。接着,根据Hertz接触理论和Preston方程进行了去除函数建模,讨论了不同转速比情况下的去除函数形状。然后,根据理论模型进行了去除函数实验、工艺参数实验以及稳定性实验,研究了压入深度、转速等工艺参数对去除结果的影响。最后,进行了200 mm口径SiC工件的仿真加工。实验结果表明:在2 mm压入深度、200 rpm转速情况下,去除区域直径为19.23 mm,体去除率达到0.197 mm 3/min,去除效率高于同等去除区域大小的传统小磨头加工方式;仿真加工结果表明:SiC仿真镜经过3.7 h加工,面形从3.008 λPV,0.553 λRMS提高到0.065 λPV,0.005 λRMS,收敛效率为达到98.18%。Abstract:In order to improve the material removal rate and reduce the fabricating cycle of large aperture optical components, a new type of high-efficiency polishing method combined with self-rotation and co-rotation movement is proposed in this paper.The structure, working principle and removal characteristics are studied.First, the mechanical structure and working principle are introduced.According to the Hertz contact theory and Preston equation, the removal function is modeled, and the shape of the removal function of different rotational speed ratio is discussed.Then, according to the theoretical model, the removal function, process parameters and stability experiments are carried out to study the influence of process parameters such as the depth and speed on the removal result.Finally, the fabrication simulation of the 200 mm diameter SiC workpiece is carried out.The experimental results show that the removal rate of the body is 0.197 mm 3/min and the diameter of removal region is 19.23 mm when the pressure depth is 2 mm and the rotation speed is 200 rpm, which is more efficient than the traditional CCOS Technology.After 3.7 hours of simulation polishing, the initial face shape of 200 mm SiC workpiece with 3.008 λPV(Peak-to-valley) and 0.553 λRMS(Root Mean Square) is improved to 0.065 λPV, 0.005 λRMS, and the convergence efficiency is 98.18%.
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图 1使用球形磨头抛光磨具内表面
Figure 1.Inner surface polishing of abrasive tool with spherical head
图 3公自转轮式抛光装置结构简图
Figure 3.Structure sketch of the co-rotation and self-rotation wheeled polishing device
图 4公自转轮式抛光装置机械结构
Figure 4.Mechanical structure of the co-rotation and self-rotation wheeled polishing device
图 10不同转速比情况下的去除函数形状比较
Figure 10.Comparison of the removal function under different rotational speed ratio
图 14归一化去除函数实验值与理论值比较
Figure 14.Comparison between experimental value and theoretical value of normalized removal function
图 15压入深度对去除区域大小的影响
Figure 15.Influence of the pressure depth on diameter of the removal area
图 18压入深度与自转速度对体积去除率的影响
Figure 18.Influence of polishing speed and pressure depth on volume removal rate
图 19轮式磨头与曲面接触区域简图
Figure 19.Principle sketch of the polishing head′s contact area with curved surface
表 1工艺参数实验结果
Table 1.Experimental results of process parameters
实验序号 自转速 度/rpm 压入深 度/mm 转台转 速/rpm 实验时 间/s 去除区域 直径/mm 体积去除效率/ (μm·mm2/min) 峰值去除率/ (μm·s-1) 1 100 0.5 10 24 9.83 24.21 0.044 2 100 1 10 16 14.16 52.75 0.091 3 100 2 10 8 19.08 111.83 0.172 4 150 0.5 10 24 9.67 33.12 0.069 5 150 1 10 16 14.07 74.25 0.140 6 150 2 10 8 18.67 161.34 0.273 7 200 0.5 10 24 9.75 42.58 0.083 8 200 1 10 16 13.98 89.17 0.173 9 200 2 10 8 19.23 196.67 0.353 
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表 2稳定性实验结果
Table 2.Stability test results of the removal function
实验序号 体积去除效率/ (μm·mm2/min) 1 16.175 2 15.946 3 16.353 4 16.436 5 16.289 下载:
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