Application and development of three-dimensional profile measurement for large and complex surface
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摘要:大型复杂曲面因为空间尺度大、结构复杂，因此对其进行测量和检测相对较困难，三维形貌测量技术分辨率高、数据获取速度快，为大型复杂曲面的偏差控制和逆向工程提供了技术保障。分析和综述了大型复杂曲面三维形貌测量及应用研究的进展，论述了目前实现大型复杂曲面三维形貌测量的手段，归纳和总结了目前以及未来几年可用大型复杂曲面三维形貌测量的设备和仪器的特点与应用场合，并对比分析了每种测量设备的优缺点，为正确和广泛应用三维形貌测量设备提供参考，重点介绍了三维点云获取方法及点云处理方法，对点云预处理方法、点云拼接方法所涉及的技术进行归纳总结。最后，对三维形貌测量技术的应用场合进行剖析，认为大型复杂曲面三维形貌测量将向着非接触、自动化方向发展，在发展过程中基于全局坐标的点云拼接、非贴点测量将成为研究的主要方向。Abstract:Because of the large spatial scale and complex structure, the large curved complex surface is more difficult to measure and detect. The three-dimensional profile measurement technology provides the technical support for deviation controlling and reverse engineering of the large complex surface due to its high resolution and fast data acquisition. Advances in large and complex three-dimensional surface topography measurement are reviewed and the current means of implementing to large complex three-dimensional surface topography measurements are discussed. Then characteristics and applications of current and future instruments used for large complex surface 3D profile measurement are summarized, and the advantages and disadvantages of each measuring device are compared. This paper provides a reference for the three-dimensional profile measurement devices that are currently widely used. There is special focus given to the acquisition method and processing methods for the 3D point cloud, the pretreatment methods and splicing methods of point cloud are summarized. Finally, the three-dimensional profile measurement technology applications are analyzed. The author believes that future research will focus on the large complex surface topography sensors toward non-contact, automated direction. In the development process, point clouds registration based on the global coordinate, non-adherent point measurement will also become the main direction of the research.
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表 1国外摄影测量系统对比
Table 1.Contrast of foreign photogrammetry systems
项目 Tritop DPA Inspect V-STARS 相机及配件 可变焦的高分辨率数字摄像机，标定杆，编码标记点，标记点 超广角镜头，标准杆，十字参考坐标，编码标记点，圆点贴，磁力连接 INCA3相机，标准杆，反光编码点，Pro-SPOT 相机标定方法 自标定 自标定 自标定 测量要求 测量时不可改变相机参数 测量时不可改变相机参数 测量时不可改变相机参数 一次测量范围 0.1~10 m 5 mm~20 m 5 mm~20 m 测量精度 0.001~0.025 mm/m ±0.015 mm/m ±0.005 mm/m 
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表 2测量设备优缺点对比
Table 2.Advantages and disadvantages of measuring equipments
测量系统 接触测量 测量精度 精度范围 测量过程 测量速度 便携性 测量范围 三坐标测量机 接触 最高 1~5 μm/m 逐点 慢 差 3 m×10 m×2 m 关节式测量臂 接触 最高 1~5 μm/m 逐点 慢 好 0~4 m 跟踪仪 非接触 高 5~10 μm/m 逐点 慢 好 0~80 m 经纬仪 非接触 高 10 μm/m 逐点 慢 好 0~150 m 全站仪 非接触 高 1 mm+1 μm 逐点 慢 好 0~150 m 雷达 非接触 高 5~10 μm/m 逐点 慢 好 0~60 m IGPS 非接触 高 0.1 mm/m 逐点 慢 好 0~20 m 摄影系统 非接触 高 ±0.025 mm/m 非逐点 快 好 0.1~10 m 机器人系统 非接触 高 0.05 mm/m 非逐点 快 差 0~5 m 下载:
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表 3三维形貌测量方法
Table 3.3D profile measurement methods
方法序号 接触式 非接触方式 声学 光学 电磁学 相干法 非相干法 被动式 主动式 飞行时间法 三角法 1 三坐标测量机 超声波测距 全息照相 立体视觉 脉冲制法 结构光(点、线) 核磁共振 2 白光干涉 层去图形 幅度调制 莫尔法 3 双波干涉 频率调制 光栅编码 4 莫尔干涉 傅立叶变换 下载:
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