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超快 选区焊接技术研究进展

张国栋,程光华,张伟

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张国栋, 程光华, 张伟. 超快 选区焊接技术研究进展[J]. , 2020, 13(6): 1209-1223. doi: 10.37188/CO.2020-0131
引用本文: 张国栋, 程光华, 张伟. 超快 选区焊接技术研究进展[J]. , 2020, 13(6): 1209-1223.doi:10.37188/CO.2020-0131
ZHANG Guo-dong, CHENG Guang-hua, ZHANG Wei. Progress in ultrafast laser space-selective welding[J]. Chinese Optics, 2020, 13(6): 1209-1223. doi: 10.37188/CO.2020-0131
Citation: ZHANG Guo-dong, CHENG Guang-hua, ZHANG Wei. Progress in ultrafast laser space-selective welding[J].Chinese Optics, 2020, 13(6): 1209-1223.doi:10.37188/CO.2020-0131

超快 选区焊接技术研究进展

doi:10.37188/CO.2020-0131
基金项目:国家重点研发计划项目(No. 2018YFB1107401)
详细信息
    作者简介:

    张国栋(1989—),男,陕西西安人,副教授,2019年于中国科学院大学获得博士学位,主要从事超快光学、超快 微纳加工方面的研究。E-mail:guodongzhang@nwpu.edu.cn

    程光华(1976—),男,陕西安康人,教授,博士生导师,法国CNRS休伯特居里实验室客座教授,2004于中国科学院西安光学精密机械研究所获得博士学位,主要从事超短脉冲 技术,超快 与物质相互作用、飞秒 微纳加工技术等方面的科学研究。E-mail:guanghuacheng@nwpu.edu.cn

    张 伟(1982—),男,河北廊坊人,中国航空制造技术研究院高级工程师,2012年于北京科技大学新金属材料国家重点实验室获得博士学位,主要从事先进 加工技术在航空发动机制造以及航空航天先进材料精密加工中的技术研究。E-mail:wzhang06@163.com

  • 中图分类号:TN249

Progress in ultrafast laser space-selective welding

Funds:National Key Research and Development Project (No. 2018YFB1107401)
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  • 摘要:超快 技术的发展为基础研究和工业生产不断注入新的动力,促发了很多新学科、新技术的诞生。超快 焊接作为近年来发展起来的一种新型材料连接技术,在航空航天、精密机械、集成光电、生物医疗等领域具有巨大的应用潜力,受到了人们的广泛关注。基于超快 非线性选区能量沉积的基本特点,超快 焊接具有广泛的材料适用性和空间选择性,可以在无嵌入层的前提下实现涉及透明材料的高质量选区焊接。本文从超快 选区焊接的物理机制、主要影响因素、适用领域入手进行了归纳与分析,并对未来该技术发展和将面临的关键挑战进行了论述。

  • 图 1(a)超快 选区焊接玻璃样品示意图[13];(b)高重频 诱导材料内部改性示意图以及超快 焊线横截面[14];(c)环形 焊线封装的窗口玻璃[13]

    Figure 1.(a) Diagram of ultrafast laser welding of glass[13]; (b) schematic diagram of internal modification induced by ultrafast laser with high pulse repetition rate and cross section of seal[14]; (c) image of two laser welded circular blanks of fused silica[13]

    图 2光学接触条件下D263玻璃与单晶硅焊接截面的元素分析[16]

    Figure 2.Element analysis of the cross-section of welded Si/D263 with post-optical contact[16]

    图 3(a)非光学接触条件下不同焦点位置对应的样品焊接截面;(b)非光学接触条件下不同 聚焦位置对应的焊接示意图[17]

    Figure 3.(a) Welding cross-sections of the non-optical-contact sample with laser focusing at different positions; (b) illustration of the evolution of the laser-matter interation near sample interface with varying focus positions[17]

    图 4(a)分离后以及(b)分离前的非交融式焊接样品截面[18]

    Figure 4.Cross sections of the non-fusion welding sample before (a) and after (b) separation[18]

    图 5(a)脉冲时延对 脉冲瞬态吸收的影响;(b)焊接强度与脉冲时延的关系[26]

    Figure 5.(a) Influence of delay times on transient absorption of laser pulse; (b) dependence of bonding strength on delay time between adjacent laser pulses[26]

    图 6超快 选区焊接透明陶瓷[12]

    Figure 6.Ultrafast laser welding of transparent ceramics[12]

    图 7(a) 能量为1.63 μJ、扫描速度为20 mm/s时 诱导D263玻璃热熔区域的横截面;(b)扫描速度为20 mm/s时超快 作用D263玻璃的无裂纹条件[45]

    Figure 7.(a) Cross-sections of D263 glass melting area at scanning speedv= 20 mm/s and laser energyΦ0= 1.63 μJ; (b) crack-free and cracking conditions atv= 20 mm/s when ultra-fast laser is applied in D263[45]

    图 8 重复频率及脉冲能量对透明玻璃材料能量吸收效率的影响[22]

    Figure 8.Influence of laser repetition rate and pulse energy on the absorptivity of the transparent glass[22]

    图 9 诱导微纳孔隙及裂纹结构的(a)透射光学显微图及(b)扫描电子显微图[49]

    Figure 9.(a) Transmission microscope images and (b) scanning electron microscope image of the laser induced bubble explosion and nanocracks[49]

    图 10(a)飞秒脉冲 聚焦于样品表面下方不同位置时, 作用区域的微观侧视图,(b) 诱导材料表面凸起,(c) 诱导热熔材料喷溅[13]

    Figure 10.(a) Side view of the laser-modified region corresponding to the femtosecond laser focused on different positions of sample surface, (b) laser-induced surface bulging, (c) laser-induced splattering[13]

    图 11扫描电子显微镜以及XPS分析下 诱导融石英玻璃与铝的有效结合层[28]

    Figure 11.Scanning electron microscope images and XPS analysis for laser-induced materials-combination layer between fused silica and aluminium[28]

    图 12(a)超快 选区封装微流器件[64-65],(b)超快 选区封装血压传感器[66],(c) 选区焊接光子晶体光纤端帽[67]

    Figure 12.(a) Microfluidic device by using ultrafast laser space-selective[64-65], (b) packaging blood pressure sensor[66], (c) photonic crystal fiber endcap by using ultrafast laser space-selective[67]

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  • 收稿日期:2020-07-28
  • 修回日期:2020-09-11
  • 网络出版日期:2020-11-10
  • 刊出日期:2020-12-01

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