Design and experiment of high-resolution detection imaging system for ultra-thin and ultra-short object-image distance
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摘要:
为缩短12寸晶圆检测成像系统的轴向和径向尺寸，提出一种小角度棱镜折转光路与超短物像距镜头相结合的解决方法。设计优于1/12
λ （λ =632.8 nm）面形精度的小角度棱镜折转光路，实现照明系统与成像镜头的水平布置，径向尺寸仅为80 mm，在保证不影响系统成像质量的前提下，极大地降低了整个系统径向尺寸，同时也实现12°的小角度明场照明。设计放大倍率为0.264的对称混合型光学系统，采用纯球面系统获得较大成像视场，像高为81.92 mm，物像距仅为392.5 mm，极大地降低了整个系统轴向尺寸。设计结果表明，整个成像系统全视场平均光学传递函数优于0.4@100l p/mm，相对畸变优于0.03%，像面照度均匀性全视场优于50%。实际测试结果表明：全视场实际成像分辨率优于18.88 μm，达到了系统极限分辨率；全视场像面照度均匀性为43.3%，满足均匀性优于40%的研制要求。本文研究结果表明提出的超薄超短物像距高分辨率检测成像系统合理、有效，解决了12寸晶圆检测成像系统空间尺寸压缩的难题，并降低了研制成本，为后续近距离大尺寸物体检测成像系统的研制提供参考依据。Abstract:To shorten the axial and radial dimensions of the 12-inch wafer detection imaging system, a solution combining the small angle prism refraction path and the ultra-short object-image distance lens is proposed. A small angle prism with shape accuracy better than 1/12
λ (λ =632.8 nm) is designed to convert the optical path and realize the horizontal arrangement between the lighting system and the imaging lens. The radial size is only 80 mm, which greatly reduces the radial size of the whole system without affecting the imaging quality. At the same time, a small angle of 12° bright field lighting is realized. A symmetrical hybrid optical system with magnification of 0.264 is designed. A pure spherical system is used to obtain a large imaging field of view. The image height is 81.92 mm, and the object-image distance is only 392.5 mm, which greatly reduces the axial size of the whole system. The design results show that the average optical transfer function of the whole imaging system is better than 0.4@100 lp/mm, the relative distortion is better than 0.03%, and the uniformity of the image surface illuminance is better than 50%. The actual test results show that the actual imaging resolution is better than 18.88 μm, which reaches the ultimate resolution of the system. The uniformity of illumination of image surface is 43.3%, which meets the development requirement of uniformity better than 40%. The research results show that the ultra-thin and ultra-short object-image distance imaging system is reasonable and effective, which solves the problem of space size compression of the 12-inch wafer detection imaging system and reduces the development cost. It provides a reference for the development of the imaging system for detecting large objects in short distance. -
图 16相面照度均匀性光电测试法
Figure 16.Photoelectric test method for uniformity of phase plane illumination
表 1材料参数
Table 1.The material parameters
材料
名称密度ρ
103kg/m3弹性模量E/
GPa泊松比μ 线膨胀系数
10−6/K微晶玻璃 2.53 91 0.24 0.05 熔石英 2.19 72 0.17 0.5 K9 2.52 79.2 0.21 8.3 
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表 3不同照度下的相面照度值
Table 3.Illuminance values under different illumination
不同照度下测试 焦面位置不同像高时像面照度值（lx） −41 mm 0 41 mm 1 14.9 34.2 14.9 2 17.5 39.9 17.5 3 16.3 36.7 15.8 4 17.7 40.0 17.4 5 13.5 30.6 13.3 6 12.3 28.5 12.3 7 9.9 23.2 9.9 8 14.5 33.3 14.4 9 16.0 36.6 16.0 10 8.9 20.7 8.8 下载:
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