Abstract:As the chip center distance becomes smaller and smaller, some adjacent bands are usually integrated and prepared on a single chip in multi-chip and multi-band applications of the same component. Therefore, the crosstalk between the chips and the reflection of the chip metal film area will have some impact on the spectral characteristics. In order to reduce the influence of band crosstalk, this paper studies the low-temperature quantificational spectrum control of integrated dual-band chip package. By preparing integrated dual-band chip package, two-band beam isolation is achieved through physical isolation between wavebands and physical cover of the metal areas. The test results show that the spectral crosstalk between chips has been significantly improved after isolation. The crosstalk between bands has been reduced from 8% to 4%, and the out-of-band response has been reduced from 6.5% to 0.78%. In order to avoid the problem of thermal mismatch between the physical isolation strip and the chip under the condition of low temperature, the isolation strip adopts the material which is completely consistent with that of the chip substrate. High-low temperature impact test of dual-band chip package shows that the thermal mismatch of the key components in the package can be solved while effectively suppressing the crosstalk in the package.