高体分SiC<sub>p</sub>/Al复合材料螺纹性能的测试 -

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高体分SiC_p/Al复合材料螺纹性能的测试

1.
中国科学院长春光学精密机械与物理研究所,吉林长春130033;
2.
中国科学院研究生院,北京100039

基金项目:

国家863高技术研究发展计划资助项目(No.863-2-5-1-13b)

详细信息

作者简介:
刘炳强(1986-),男,内蒙古扎兰屯人,硕士研究生,主要从事空间相机光机结构设计方面的研究。 E-mail:saiwaisuhang@yahoo.cn

中图分类号:V257; V243.5
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- 被引次数:0
出版历程
- 收稿日期:2011-09-11
- 修回日期:2011-11-13
- 刊出日期:2011-12-25

Characteristic test of threads on high volume fraction SiC_p/Al composites

1.
Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130033, China;
2.
Graduate University of Chinese Academy of Sciences, Beijing 100039, China

摘要

摘要:从SiCp/Al复合材料性能分析着手,讨论了预置件法、焊接法和粘接法等在空间遥感器研制中常用的联接方法的优缺点,提出了在高体积分数(体分)SiCp/Al复合材料上直接加工螺纹,并加装钢丝螺套的方法来改善螺纹联接性能。对在某高体分SiCp/Al复合材料上加工的M4、M5螺纹进行了拉伸测试,结果表明:加装钢丝螺套前,复合材料螺纹有被拉脱现象;加装钢丝螺套后,M4螺纹、螺杆在3 000~4 000 N被拉断;M5螺纹、螺杆在8 000~9 000 N被拉断,测试后两种规格的螺纹状态良好,可以满足实际应用对该材料拉伸强度的要求,其已应用于工程项目中。
- 高体分SiCp/Al材料/
- 复合材料-金属联接/
- 复合材料螺纹/
- 螺纹拉伸强度
Abstract:Based on analysis of properties of SiCp/Al composites, the advantages and disadvantages of common connecting methods for space optical sensors such as fore-imbedding, welding and bonding were demonstrated. A new method of machining threads directly on high volume fraction SiCp/Al composites and mounting steel wire thread sleeves to improve the thread connection was proposed. The tensile test for M4 and M5 threads on high volume fraction SiCp/Al composites were performed. Obtained results suggest that some of them are pulled out before mounting the steel wire thread sleeve. However, M4 and M5 screws are pulled off under 3 000-4 000 N and 8 000-9 000 N, respectively, after mounting the steel wire thread sleeve. The M4 and M5 threads show good shapes, which means that machining threads directly on high volume fraction SiCp/Al composites and mounting the steel wire can meet the requirements of the engineering for tensile strength and it is already used in some projects.
- high volume fraction SiCp/Al composite/
- composite-metal joining/
- thread on composite/
- tensile strength of thread

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参考文献 (1)

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